中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2017, Vol. 17 ›› Issue (11): 44 -48. doi: 10.16257/j.cnki.1681-1070.2017.0137

• 微电子制造与可靠性 • 上一篇    

栅氧化方式对NMOS器件总剂量电离效应的影响

刘佰清,刘国柱,吴健伟,洪根深,郑若成   

  1. 中国电子科技集团公司第五十八研究所,江苏无锡 214035
  • 收稿日期:2017-06-27 出版日期:2017-11-20 发布日期:2017-11-20
  • 作者简介:刘佰清(1989—),男,南京大学物理电子学硕士,2014年7月进入中国电子科技集团公司第五十八研究所工作,主要负责抗辐射工艺集成技术开发。

The Effect of Oxidation Methods on TID Radiation

LIU Baiqing,LIU Guozhu,WU Jianwei,HONG Gensheng,ZHENG Ruocheng   

  1. China Electronics Technology Corporation No.58 Research Institute,Wuxi 214035,China
  • Received:2017-06-27 Online:2017-11-20 Published:2017-11-20

摘要: 基于抗辐射0.6 μm CMOS工艺,对5 V/20 Vamp;LV/HV NMOS器件进行了总剂量加固结构设计,并采用叠栅氧工艺成功制备了抗总剂量能力≥500 krad(Si)高低压兼容的NMOS器件。重点研究了不同的栅氧化工艺对NMOS器件总剂量辐射电离效应的影响作用。研究发现,在抗总剂量电离能力方面,湿法氧化工艺优于干法氧化工艺:即当栅氧厚度小于12.5 nm时,LVNMOS器件因总剂量电离效应引起的阈值电压漂移ΔVtn受栅氧化方式的影响甚小;当栅氧厚度为26 nm时,HVNMOS器件因总剂量电离效应引起的阈值电压漂移ΔVtn受栅氧化方式及工艺温度的影响显著。在500 krad(Si)条件下,采用850℃湿氧+900℃干氧化方式的HVNMOS器件阈值电压漂移ΔVtn比采用800℃湿氧氧化方式的高2倍左右。

关键词: 栅氧化, 总剂量电离效应, 阈值电压漂移ΔVtn

Abstract: The radiation ionization of total dose(TID)of the LV/HVNMOS based on the CMOS standard process has been analysed.For the LVNMOS witch the gate oxide thickness less than 12.5 nm,it is found that the dryandwetoxidationmethodshave little effect about the threshold voltage drift(ΔVtn)due to the TID effect.Under the condition of 500 krad(Si),the ΔVtnof the device prepared by the wet-oxidation process is 0.025 V less thanthe device thatpreparedbydry-oxidationprocess.For the HVNMOS device which the gate oxide thickness was 26 nm,the effect of the oxidation process and the oxidation temperature due to the TID was significant.Under the condition of 500K rad(Si),the threshold voltage drift(ΔVtn)due to the TID effect which prepared by the dry-oxidation process(900℃)was about 3 times higher than the wet-oxidation process.The superiority of the TID effect ΔVtn is mainly attributed to the charge transfer effect of SiO2/Si interface trap.

Key words: gate oxide process, TID, threshold voltage drift ΔVtn

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