集成微系统多物理场耦合效应仿真关键技术综述*

doi:10.16257/j.cnki.1681-1070.2021.1004

摘要/Abstract

摘要： 先进集成技术的发展以应用为驱动，近年来在智能应用、5G通信、物联网、卫星通信等领域得到了空前关注。然而，集成微系统中信号串扰、腔体效应、自热效应等导致的可靠性问题分布更加密集，跨层级多场耦合过程高效数值仿真是实现集成微系统高效能设计的技术保障。多场耦合仿真已成为跨学科领域研究的主流方向之一，正成为促进电子科学与技术、信息科学与技术等进步的重要手段。主要介绍了集成微系统多物理场耦合仿真中关于数理建模、数值求解以及大规模问题加速求解算法的发展现状及关键技术。

关键词: 集成微系统, 多物理场, 数值计算方法, 并行计算方法

Abstract: The development of advanced integration technology is driven by applications and it receives unprecedented attention in intelligent application, 5G communication, internet of things, satellite communication fields in recent years. However, the reliability problems caused by signal crosstalk, cavity effect and self-heating effect in integrated microsystems become more intensive with the increasing integration. Efficient numerical multiphysics coupling simulation plays critical role in guaranteeing efficient integrated microsystem design. Multiphysics coupling simulation has become one of the main research directions in the interdisciplinary field and is becoming an important means to promote the progress of electronic science and technology, information science and technology. The key technologies and development status of multiphysics modeling, numerical method, and acceleration algorithm for large-scale applications in multiphysics coupling simulation of integrated microsystems are introduced.

Key words: integratedmicrosystem, multiphysics, numericalcomputingmethod, parallelcomputingalgorithm

中图分类号:

张鹏, 孙晓冬, 朱家和, 王晶, 王大伟, 赵文生. 集成微系统多物理场耦合效应仿真关键技术综述^*[J]. 电子与封装, 2021, 21(10): 100104 .

ZHANG Peng, SUN Xiaodong, ZHU Jiahe, WANG Jing, WANG Dawei, ZHAO Wensheng. Review on Multiphysics Coupling SimulationProgresses in Integrated Micro-System[J]. Electronics & Packaging, 2021, 21(10): 100104 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

集成微系统多物理场耦合效应仿真关键技术综述^*

Review on Multiphysics Coupling SimulationProgresses in Integrated Micro-System

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