关键词: 引线键合, 超低弧, 金丝球焊, 射频互联

Abstract: The wire bonding process is one of the key means to realize the interconnection of millimeter-wave radio frequency (RF) components. With the rapid development of millimeter-wave subsystems, the working frequency band of millimeter-wave components is getting higher and higher, which puts forward new requirements for the loop height of the interconnection gold wire in the RF channel. Excessive lead radian makes the standing wave of the system larger, which seriously affects the microwave characteristics of circuit. It is difficult to meet the requirements of short span and low loop height in RF interconnection due to the existence of lead heat-affected zone in ball welding process. Through the optimization test of key parameters in the process of thermal ultrasonic ball welding of 25 μm gold wire into loop, the heat-affected zone is folded and bonded on the first welding spot. Under the premise of ensuring the strength of the lead wire, the gold wire interconnection with a short span of 300 μm and an ultra-low loop height of 80 μm is realized. It provides a realization idea for the application of ball welding technology in the interconnection of millimeter wave RF components.

Key words: wirebonding, ultra-low loop, gold ball bonding, RF interconnection