关键词: 电子封装, 集成电路, 产学研, 国际化

Abstract: Electronic packaging is the science and technology to establish the interconnections and suitable working environments for electronic circuits, serving as a bridge that constitutes chip-device-component-product. The manufacturing and research field is multi-disciplinary and beyond the discipline. As one said, “One generation of the chip needs one generation of packaging”. With the reduction of the characteristic size of integrated circuit and the improvement of the operating speed, new and higher requirements have been put forward for integrated circuit packaging technology. Due to the nature of the multi-disciplinary and cutting-edge technology of electronic packaging, the mode of integrating talents in various fields to solve packaging problems can no longer meet the needs of technological development, under the background of the development of the first-level disciplines of integrated circuits. This paper reviews the training mode of integrated circuit talents at home and abroad, and analyzes the current construction and development status of the current training system for electronic packaging technology professionals. Taking the exploration and practice of Harbin Institute of Technology in the cultivation mode of integrated circuit talents as an example, it is proposed that talent training should pay more attention to the practical aspects, and be connected with the postgraduate course, and cultivate high-end compound talents with comprehensive capabilities through the trinity of industry, academia, and research.

Key words: electronic packaging, integrated circuit, industry-academia-research, internationalization