中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (8): 080202 . doi: 10.16257/j.cnki.1681-1070.2023.0099

• 封装、组装与测试 • 上一篇    下一篇

功率器件塑封过程中引脚压伤问题研究

张怡   

  1. 广东气派科技有限公司,广东 东莞 523000
  • 收稿日期:2023-01-31 出版日期:2023-08-24 发布日期:2023-08-24
  • 作者简介:张怡(1994—),男,湖南临澧人,本科,助理工程师,从事集成电路的封测研发工作。

Research on Pin Crushing During Plastic Packaging of Power Devices

ZHANG Yi   

  1. Guangdong Chippacking Technology Co., Ltd.,Dongguan 523000, China
  • Received:2023-01-31 Online:2023-08-24 Published:2023-08-24

摘要: 引线框架的引脚压伤是严重的质量问题,引脚压伤不仅会影响产品的外观质量,严重时会导致产品的电性能异常,甚至导致终端使用时发生短路、尖端放电等问题。结合实际发生的异常案例,列举了塑封过程中导致压伤的风险因素并逐项进行试验分析。采用Minitab软件进行了双比率及相关性试验,确认导致异常的主要因素。由此延伸到其他可能导致压伤的成因,确定了不同影响因素与引脚压伤的关联性。并从模具设计及工艺方法的角度提出改善意见,为改善实际生产中出现的引脚压伤问题提供了参考。

关键词: 引脚压伤, 齿形镶件, 塑封模具, 相关性

Abstract: Pin crushing on lead frames is a serious quality issue, which not only affects the quality of the products appearance, but also leads to serious abnormalities in the electrical properties and even leads to short circuits and tip dischargesand other abnormalities during terminal use. The risk factors for pin crushing during plastic packaging process are listed and analysed on a test-by-test basis, taking into account the unusual cases that have actually occurred. The double ratio and correlation test are conducted using Minitab software to identify the main influencing factors for the occurrence of anomalies. This is extended to other possible causes of pin crushing, and the correlation between different influencing factors and pin crushing is established.And improvement suggestions are proposed from the perspective of mold design and process methods, providing a reference for improving the pin crushing problem that occurred in actual production.

Key words: pin crushing, toothed inserts, plastic packaging molds, relevance

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