关键词: 热应力翘曲, 玻璃基板, 仿真实验, 双材料板

Abstract: Thermal stress warping of glass substrates for packaging is investigated through a combination of theoretical analysis, simulation and experimental verification. The results show that the glass substrates have a significant effect in reducing thermal stress warping compared to the traditional organic compound substrates. Taking the bi-material plate model as the research object, the effects of different factors on thermal stress warping are summarized by analyzing and comparing different models. Increasing the thickness of the glass substrates has the most significant effect on reducing warping. Improving the coefficient of thermal expansion (CTE) of the glass substrates to be close to the CTE of the stacked films can help to reduce warping. Dividing the stacked film into more zones can significantly improve warping. Meanwhile, gravity is also an important factor that cannot be ignored. The placement of the product determines the direction of warping and affects the warping value.

Key words: thermal stress warping, glass substrates, simulation experiment, bi-material plate