有机封装基板常见失效模式与制程控制

doi:10.16257/j.cnki.1681-1070.2024.0064

电子与封装 ›› 2024, Vol. 24 ›› Issue (2): 020109 . doi: 10.16257/j.cnki.1681-1070.2024.0064

• “高密度有机封装基板”专题 • 上一篇下一篇

有机封装基板常见失效模式与制程控制

周帅林,孟凡义,张领,李国有,滕少磊

清河电子科技山东有限责任公司，济南? 250000

收稿日期:2023-10-30 出版日期:2024-02-29 发布日期:2024-02-29
作者简介:周帅林（1993—），男，湖北武汉人，本科，主要从事封装基板制造工艺的研究。

Common Failure Modes and Process Control of Organic Package Substrates

ZHOU Shuailin, MENG Fanyi, ZHANG Ling, LI Guoyou, TENG Shaolei

Qinghe Electronic and Technology Shandong Co., Ltd., Jinan 250000, China

Received:2023-10-30 Online:2024-02-29 Published:2024-02-29

摘要/Abstract

摘要： 随着封装技术的迅速发展，集成电路封装需要具备微型化、多功能化、高频、高速、高性能以及低成本等特点。为了满足先进封装的需求，有机封装基板朝着小孔径、高布线密度、小尺寸等方向发展，这一发展趋势对基板的机械稳固性、散热性和电学性能提出了更高的要求，对内部互连可靠性、离子迁移以及焊点牢固性的控制带来很大挑战。研究了孔底开裂、离子迁移、焊点开裂等失效模式，分析其失效机理，总结失效模式的影响因素，有针对性地提出了有效的基板制程控制措施。

关键词: 孔底开裂, 离子迁移, 焊点开裂, 失效模式, 制程控制

Abstract: With the rapid development of packaging technology, integrated circuit packaging needs to have characteristics such as miniaturization, multi-functionality, high frequency, high speed, high performance and low cost. In order to meet the needs of advanced packaging, organic package substrates are developing towards smaller aperture, high wiring density and smaller size. This development trend puts forward higher requirements on mechanical stability, heat dissipation and electrical performance of substrates, bringing great challenges to the control of the reliability of internal interconnections, ion migration and firmness of solder joints. Failure modes such as hole bottom cracking, ion migration and solder joint cracking are studied, their failure mechanisms are analyzed, influencing factors of failure modes are summarized, and effective control measures for substrate manufacturing process are proposed in a targeted manner.

Key words: hole bottom cracking, ion migration, solder joint cracking, failure mode, control for manufacturing process

中图分类号:

TN305.94

周帅林,孟凡义,张领,李国有,滕少磊. 有机封装基板常见失效模式与制程控制[J]. 电子与封装, 2024, 24(2): 020109 .

ZHOU Shuailin, MENG Fanyi, ZHANG Ling, LI Guoyou, TENG Shaolei. Common Failure Modes and Process Control of Organic Package Substrates[J]. Electronics & Packaging, 2024, 24(2): 020109 .

参考文献

[1] 方志丹, 于中尧, 武晓萌, 等. FCBGA基板关键技术综述及展望[J]. 电子与封装, 2023, 23(3): 030103.
[2] NAKAHARA S. Microscopic mechanism of the hydrogen effect on the ductility of electroless copper[J]. Acta Metallurgica, 1988, 36(7): 1669-1681.
[3] KONISHI S, MORIYAMA M, MURAKAMI M. Effect of annealing atmosphere on void formation in copper interconnects[J]. Materials Transactions, 2002, 43(7): 1624-1628.
[4] BOYMANS E E. Pd and Pt nanoparticles as selective hydrogenation catalysts[J]. Eindhoven: Eindhoven University of /Technology, 2015.
[5] BERNHARD T, GREGORIADES L, BRANAGAN S, et al. Nanovoid formation at Cu/Cu/Cu interconnections of blind microvias: A field study[J]. International Symposium on Microelectronics, 2019(1): 000492-000502.
[6] GRAEBNER J E, OKINAKA Y. Molecular hydrogen in electroless copper deposits[J]. Journal of Applied Physics, 1986, 60(1): 36-39.
[7] SHARMA T, LANDRY A E, LEGER A, et al. Nickel dependence of hydrogen generation, hydrogen co-deposition and film stress in an electroless copper process[J]. Thin Solid Films, 2018, 666(30): 76-84.
[8] BERNHARD T, ZARWELL S, BRüNING F, et al. Main impact factors on internal stress of electroless deposited copper films[C]// 48th International Symposium on Microelectronics: IMAPS 2013, Advanced Packaging & the Internet of Things: The Future of Our Industry, Orlando, Florida, USA, 2016: 99-104.
[9] 白蓉生. 盲孔脱垫的真因与改善(上)[J]. 印制电路资讯, 2019(4): 90-98.
[10] HUNT C. Susceptibility of glass-reinforced epoxy laminate to conductive anodic filamentation[J]. Circuitree, 2007, 20(3): 30-35.
[11] JANG J W, KIM P G, TU K N, et al. Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology[J]. Journal of Applied Physics, 1999, 85(12): 8456-8463.
[12] SOHN Y C, YU J, KANG S K, et al. Study of spalling behavior of inter-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders[C]// 2004 Proceedings. 54th Electronic Components and Technology Conference, Las Vegas, NV, USA, 2004.
[13] LIU P L, LIN C, PATHANGEY B, et al. The mechanism of dense interfacial voids and its impact on solder joint reliability[C]// 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2016.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

有机封装基板常见失效模式与制程控制

Common Failure Modes and Process Control of Organic Package Substrates

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 3

编辑推荐

Metrics

本文评价

[1]	朱国灵;季振凯;纪萍;徐小明. 塑封倒装焊焊点开裂分析及改善研究[J]. 电子与封装, 2023, 23(2): 20204-.
[2]	张潇睿. 基于不同键合参数的Cu-Sn-Cu微凸点失效模式分析[J]. 电子与封装, 2022, 22(1): 10201-.
[3]	李泊. 微波产品焊点典型失效模式可靠性研究[J]. 电子与封装, 2019, 19(7): 7-12.