中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2017, Vol. 17 ›› Issue (11): 36 -38. doi: 10.16257/j.cnki.1681-1070.2017.0135

• 微电子制造与可靠性 • 上一篇    下一篇

11~12 GHz单电源GaN微波功率放大模块研制

嵇妮娅,汤茗凯,唐世军   

  1. 南京电子器件研究所,南京 210016
  • 收稿日期:2017-07-31 出版日期:2017-11-20 发布日期:2017-11-20
  • 作者简介:嵇妮娅(1981—),女,江苏泰州人,工学学士,工程师,2003年毕业于南京航空航天大学,现为中国电子科技集团公司第五十五研究所工程师,主要研究方向为微波功率放大器的生产与管理。

The Development of an 11~12 GHz GaN Microwave Power Amplifier Module of Single Power Supply

JI Niya,TANG Mingkai,TANG Shijun   

  1. Nanjing Electronic Devices Institute,Nanjing 210016,China
  • Received:2017-07-31 Online:2017-11-20 Published:2017-11-20

摘要: 报告了采用凹槽栅场板结构的GaN微波功率HEMT管芯,优化了场板结构和工艺参数,制作了0.8 mm和2.4 mm栅宽的管芯。采用该管芯制作了两级放大的功率模块,该模块匹配电路制作在380 μm厚的Al2O3陶瓷基片上,匹配电容制作在180 μm厚的高介电常数的陶瓷基片上。电感采用25 μm直径的金丝拟合,电路结构采用单电源结构。该模块在11~12 GHz、28 V工作电压下,饱和输出功率达到了8 W,功率增益为12 dB,功率附加效率(PAE)为30%,实现了低电流、高效、高可靠性、可实用的功率模块。该模块是迄今为止采用单电源结构频率最高的GaN功率模块。

关键词: 氮化镓, 高电子迁移率晶体管, 功率放大模块

Abstract: An 11~12 GHz power amplifier module of single power supply has been developed.This module is based on 0.8 mm and 2.4 mm GaN HEMTs with optimized field-plate structure and process.All the internal matching circuits are fabricated on Al2O3ceramic substrate of 380 μm thickness,and the matching capacitors are fabricated on high permittivity ceramic of 180 μm thickness.The matching inductors are realized of gold bonding wires of 25 μm diameter.During the frequency band of 11~12 GHz and under 8 V supply voltage,the module can realize 8 W output power,12 dB power gain and 30%power added efficiency(PAE)simultaneously.The measurement results indicated that a low operation current,high efficiency,high reliability and applicable power amplifier module has been realized.As a power module with single power supply,it operates at the highest frequency band state of art.

Key words: GaN, HEMT, power amplifier module

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