扇出型封装发展、挑战和机遇

doi:10.16257/j.cnki.1681-1070.2020.0801

电子与封装 ›› 2020, Vol. 20 ›› Issue (8): 080101 . doi: 10.16257/j.cnki.1681-1070.2020.0801

• 综述 • 下一篇

扇出型封装发展、挑战和机遇

吉勇¹，王成迁^1,2，李杨¹

1. 中科芯集成电路有限公司，江苏无锡 214072；2.厦门大学，福建厦门 361005

接受日期:2020-03-08 出版日期:2020-08-25 发布日期:2020-04-02
作者简介:吉　勇（1985—），男，江苏泰州人，工程师，目前主要从事晶圆级先进封装研究相关工作。

Development, Challenges and Opportunities of Fan-out Packaging

JI Yong¹, WANG Chengqian^1,2, LI Yang¹

1. China Key System & Integrated Circuit Co., Ltd., Wuxi 214072, China; 2. Xiamen University, Xiamen 361005, China

Accepted:2020-03-08 Online:2020-08-25 Published:2020-04-02

摘要/Abstract

摘要： 扇出型封装在集成电路封装中受到越来越多的关注，近年来取得了长足进步，也被认为是延续和超越摩尔定律的关键技术方案。根据扇出型封装的发展趋势，从当前扇出型封装几种重要的技术路线、技术应用、未来挑战和机遇方面进行了系统梳理。详细对比分析了圆片级树脂型扇出封装、硅基晶圆级扇出型封装和面板级扇出型封装技术方法和特点，阐述了半导体设备和材料对扇出型封装的影响和相互协同发展。最后，从技术、应用和市场战略方面分析了扇出型封装存在的挑战和机遇。

关键词: 扇出型封装, 先进封装, 延续和超越摩尔定律

Abstract: Fan-out packaging has attracted more and more attention in IC packaging, and has also made a great progress in recent years. It is also considered to be a key technical solution to support More-than-Moore law. In this paper, three kinds of fan-out packaging routes, applications, challenges and opportunities were introduced. Process flows and characteristics of eWLB, eSiFO and PLP packaging technologies were detailed analyzed. Meanwhile, the relationship between improvement of semiconductor equipment as well as materials and development of fan-out packaging was explained. Finally, the challenges and opportunities of fan-out packaging are analyzed from the aspects of technology, application and market strategy.

Key words: Fan-out packaging, advanced packaging, More-than-Moore

中图分类号:

TN305

吉勇，王成迁，李杨. 扇出型封装发展、挑战和机遇[J]. 电子与封装, 2020, 20(8): 080101 .

JI Yong, WANG Chengqian, LI Yang. Development, Challenges and Opportunities of Fan-out Packaging[J]. Electronics & Packaging, 2020, 20(8): 080101 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

扇出型封装发展、挑战和机遇

Development, Challenges and Opportunities of Fan-out Packaging

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