中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (6): 060201 . doi: 10.16257/j.cnki.1681-1070.2021.0605

• 封装、组装与测试 • 上一篇    下一篇

对于EMC封装模具离型性的改良研究

潘旭麒;李进;袁健;程琪   

  1. 长兴电子材料有限公司,江苏 ?昆山 215301
  • 收稿日期:2020-11-23 出版日期:2021-06-23 发布日期:2021-01-07
  • 作者简介:潘旭麒(1994—),男,浙江湖州人,硕士,从事环氧塑封料的开发与应用研究。

Research on the Improvementof Mold Release Properties for EMC Packaging

PAN Xuqi, LI Jin, YUAN Jian, CHENG Qi   

  1. Eternal Electronic Materials Co., Ltd., Kunshan 215301, China
  • Received:2020-11-23 Online:2021-06-23 Published:2021-01-07

摘要: 随着聚乙烯蜡(PE蜡)在环氧塑封料(EMC)中的广泛应用,其在高温环境下氧化而导致的模具离型性变差的问题也变得日益突出。通过从抑制PE蜡高温氧化入手,研究抗氧化剂的加入对模具离型性及EMC产品性能的影响。结果表明,在EMC材料中加入AO-60或AO-412S这两种抗氧化剂,不但不会对材料本身性能产生严重影响,而且还能有效改善模具久置后离型性降低的问题。随着抗氧化剂用量的增加,对于模具离型性的改善先提升后基本保持不变,添加量在5 phr时即能取得不错的效果。

关键词: 聚乙烯蜡, 环氧塑封料, 离型性, 抗氧化剂

Abstract: With the wide application of polyethylene wax (PE wax) in epoxy molding compound (EMC), the problem of poor mold release due to its oxidation under high temperature environment has become more and more prominent. Starting from the suppression of high temperature oxidation of PE wax, the effect of the addition of antioxidants on mold release and EMC product performance was studied. The results show that adding AO-60 or AO-412S these two antioxidants to EMC materials not only does not have a serious impact on the performance of the material itself, but also can effectively improve the problem of reduced mold release after a long time. With the increase in the amount of antioxidants, the improvement of mold release properties is first improved and then remains basically unchanged, and good results can be achieved when the addition amount is 5 phr.

Key words: polyethylenewax, epoxymoldingcompound, releaseproperty, antioxidant

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