非等温DSC研究EMC的固化动力学

doi:10.16257/j.cnki.1681-1070.2020.0904

电子与封装 ›› 2020, Vol. 20 ›› Issue (9): 090203 . doi: 10.16257/j.cnki.1681-1070.2020.0904

非等温DSC研究EMC的固化动力学

王殿年;郭本东;杨春梅

长兴电子材料有限公司，江苏昆山 215301

发布日期:2020-04-22
作者简介:王殿年（1977—），男，江苏泰州人，本科，从事环氧塑封料的开发及客户端技术服务工作。

Study on Curing Kineticsof EMC by DSC

WANG Diannian, GUO Bendong, YANG Chunmei

?Eternal Electronic Materials Co.Ltd., Kunshan 215301, China

Published:2020-04-22

摘要/Abstract

摘要： 采用非等温差示扫描热量仪（DSC）对环氧塑封料共混物体系的固化过程进行了研究。利用T-Φ外推法确定了固化工艺温度，并用Kissinger、Ozawa和Crane法计算共混体系固化反应的表观活化能Ea、指前因子A和固化反应级数等动力学参数。结果表明，TPTP和DBU促进剂具有高温区快速固化的特点，使用这两种促进剂该体系的活化能均在62 kJ/mol以上，反应级数n均小于1，表明该体系的固化反应是一个复杂反应，使用T-Φ外推法计算出凝胶温度分别为66.15 ℃和70.65 ℃。

关键词: DSC, 环氧塑封料, 促进剂

Abstract: The curing reactions of epoxy molding compound was studied by non-isothermal differential scanning calorimetric(DSC). Curing temperature was calculated by T-Φ extrapolation. The curing kinetics parameters of blend systems, including the apparent activation energy(Ea), the frequent factor (A) , the reaction order (n) and other parameters were calculated by Kissinger，Ozawa and Crane method. The results indicated that the TPTP and DBU catalyst were quickly reacted at high temperature, the apparent activation energy were above 62 KJ/mol and the reaction order were below 1, so this reaction is a complex reaction. The gel temperature of TPTP/EMC and DBU/EMC was 66.15℃ and 70.65℃, respectively.

Key words: DSC, epoxy molding compound, catalyst

中图分类号:

TN305.94

王殿年;郭本东;杨春梅. 非等温DSC研究EMC的固化动力学[J]. 电子与封装, 2020, 20(9): 090203 .

WANG Diannian, GUO Bendong, YANG Chunmei. Study on Curing Kineticsof EMC by DSC[J]. Electronics & Packaging, 2020, 20(9): 090203 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

非等温DSC研究EMC的固化动力学

Study on Curing Kineticsof EMC by DSC

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