中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (9): 090402 . doi: 10.16257/j.cnki.1681-1070.2021.0911

• 微电子制造与可靠性 • 上一篇    下一篇

单粒子翻转效应的FPGA模拟技术*

陈鑫;施聿哲;白雨鑫;陈凯;张智维;张颖   

  1. 南京航空航天大学电子信息工程学院,南京 210016
  • 收稿日期:2021-01-20 发布日期:2021-04-28
  • 作者简介:陈鑫(1982—),男,江苏句容人,博士,副教授,研究方向为数字集成电路设计。

FPGA EmulationTechnologyforSingle Event Upset

CHEN Xin, SHI Yuzhe, BAI Yuxin, CHEN Kai, ZHANG Zhiwei, ZHANG Ying   

  1. College of Electronicand Information Engineering, NanjingUniversity of Aeronautics and Astronautics, Nanjing 210016, China
  • Received:2021-01-20 Published:2021-04-28

摘要: 随着半导体工艺节点遵循着摩尔定律逐渐缩小,空间环境中辐射诱发的单粒子效应(Single Event Effect, SEE)对集成电路造成的影响却在不断增加。单粒子翻转(Single Event Upset, SEU)效应是最为普遍的单粒子效应,表现为电路存储单元和时序逻辑中的逻辑位翻转,在集成电路中常采用故障注入技术来模拟单粒子翻转效应。因此,重点研究了目前较为常用的3种故障注入技术,分别是现场可编程门阵列(Field Programmable Gate Array, FPGA)重配置,扫描链和旁路电路,分析了各自的优势和不足,并对未来的发展趋势进行了预测。

关键词: 单粒子效应, 单粒子翻转, 超大规模集成电路, FPGA模拟, 故障注入

Abstract: Following Moore's law, the character size of semiconductor process node is decreasing, and the impact of radiation-induced single event effect (SEE) on integrated circuits is increasing. The single event upset (SEU) effect, which represents the bit flip in the memory cell and sequential logic, has a higher probability of occurrence in SEE. Fault injection technique is often adopted to emulate SEU effect in integrated circuit. Therefore, three fault injection technologies which are dynamic reconfiguration, scan chain and bypass circuit are studied. In addition, the advantages and disadvantages of these methods are also analyzed. The general trend of field programmable gate array (FPGA) emulation technology is made at last.

Key words: singleeventeffect, singleeventupset, VLSI, FPGAemulation, faultinjection

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