中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (6): 032 -40. doi: 10.16257/j.cnki.1681-1070.2019.0609

• 微电子制造与可靠性 • 上一篇    下一篇

粒子入射条件对28 nm SRAM 单元单粒子电荷共享效应影响的TCAD 仿真研究

金 鑫1,唐 民1,于庆奎1,张洪伟1,梅 博1,孙 毅1,唐路平2   

  1. 1.中国空间技术研究院宇航物资保障事业部,北京 100029;2.国防科技大学,长沙 410073
  • 收稿日期:2019-03-25 出版日期:2019-06-19 发布日期:2019-06-19
  • 作者简介:金 鑫(1993—),男,河南南阳人,硕士研究生,研究方向为宇航元器件抗辐射技术。

TCAD Simulation Research on the Influence of Particle Incidence Conditions on Single Event Charge Sharing Effect of 28 nm SRAM

JIN Xin,TANG Min,YU Qingkui,ZHANG Hongwei,MEI Bo,SUN Yi,TANG Luping   

  1. 1.Astronautical Material Support Department,China Academy of Space Technology,Beijing 100029,China;2.National University of Defense Technology,Changsha 410073,China
  • Received:2019-03-25 Online:2019-06-19 Published:2019-06-19

摘要: 利用器件仿真工具TCAD,建立28 nm 体硅工艺器件的三维模型,研究了粒子入射条件和器件间距等因素对28 nm 体硅工艺器件单粒子效应电荷共享的影响规律。结果表明,粒子LET 值增大、入射角度的增大、器件间距的减小和浅槽隔离(STI)深度的减少都会增加相邻器件的电荷收集,增强电荷共享效应,影响器件敏感节点产生的瞬态电流大小;SRAM 单元内不同敏感节点的翻转阈值不同,粒子LET 值和入射角度的改变会对SRAM 单元的单粒子翻转造成影响;LET 值和粒子入射位置变化时,多个SRAM 单元发生的单粒子多位翻转的位数和位置也会变化。

关键词: 多位翻转, 器件仿真, 28 nm, 单粒子效应, 电荷共享, 多位翻转

Abstract: The three-dimensional model of 28 nm bulk silicon process device was established by using 3D TCAD simulation,and the influence of particle incidence conditions,device spacing and other factors on the single event effect charge sharing of 28 nm bulk silicon process device were studied.The results show that the LET value increasement of particles,the increase of incident Angle,the decrease of device spacing and the reduction of STI depth will increase the charge collection of adjacent devices,enhance the charge sharing effect,and affect the transient current generated by the sensitive nodes of devices.The flip threshold of different sensitive nodes in the SRAM cell is disparate,and the change of particle LET value and incident angle will affect the single event upset of the SRAM cell.When LET value and particle incidence position change,the number and position of multiple cells upset occurring in multiple SARM cells will also change.

Key words: device simulation, 28 nm, single event effect, charge collection, device simulation, multiple cells upset, 28 nm, single event effect, charge collection, multiple cells upset

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