基于电容补偿的键合金丝互连微波特性研究

doi:10.16257/j.cnki.1681-1070.2021.0913

电子与封装 ›› 2021, Vol. 21 ›› Issue (9): 090207 . doi: 10.16257/j.cnki.1681-1070.2021.0913

基于电容补偿的键合金丝互连微波特性研究

王磊;王爱华

中国航天科工集团8511研究所，南京　210007

收稿日期:2021-03-11 发布日期:2021-04-29
作者简介:王磊（1985—），男，江苏灌南人，硕士，高级工程师，主要从事微波毫米波组件及系统方向的研究。

Research on the MicrowaveCharacteristic of Bonding Wire Based on Capacitance Compensation

WANG Lei, WANG Aihua

No. 8511 Research Institute ofCASIC, Nanjing 210007, China

Received:2021-03-11 Published:2021-04-29

摘要/Abstract

摘要： 对键合金丝互连线的电磁特性进行建模仿真分析，并根据键合互连线的等效电路模型，设计了容性补偿枝节来改善金丝互连的微波信号传输特性。仿真结果表明，设计的金丝键合容性补偿枝节可以显著改善电路传输特性。在Ka波段，容性补偿枝节电路的插入损耗比补偿前减小了约0.15 dB；电压驻波比在30～40 GHz范围内改善了约0.4。

关键词: 电容补偿, 金丝互连, 微波特性, Ka波段

Abstract: The electromagnetic characteristics of wire bonding is modeled and analyzed, and according to the equivalent circuit model of bonding interconnect, the capacitance compensation structure is designed to improve the microwave transmission characteristics of bonding interconnect. The simulation results show that the wire bonding capacitance compensation structure can obviously improve the circuit transmission characteristics. In the Ka band, the insertion loss is minimized about 0.15 dB compared to the gold wire interconnecting without capacitance compensation; VSWR is improved (30~40 GHz) by about 0.4.

Key words: capacitancecompensation, wirebonding, microwavecharacteristics, Kaband

中图分类号:

TN305.94

王磊;王爱华. 基于电容补偿的键合金丝互连微波特性研究[J]. 电子与封装, 2021, 21(9): 090207 .

WANG Lei, WANG Aihua. Research on the MicrowaveCharacteristic of Bonding Wire Based on Capacitance Compensation[J]. Electronics & Packaging, 2021, 21(9): 090207 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

基于电容补偿的键合金丝互连微波特性研究

Research on the MicrowaveCharacteristic of Bonding Wire Based on Capacitance Compensation

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