关键词: LTCC基板, 丝网印刷, 离网间距, 印刷速度

Abstract: The integration and miniaturization of communication equipment puts require the higher integration and fabrication precision on low-temperature co-fired ceramic (LTCC). Specifically, the precision of vias and the signal lines should be enhanced to 50 μm from the traditional 100 μm. Since the line accuracy can be achieved by the domestic conventional LTCC circuit is generally about 100 μm, in order to improve the process capability, orthogonal experiments for these key parameters were carried out. And through analyzing these influencing factors, the optimized process parameters were determined. Based on the improved technology on 50 μm higher precision, the engineering products were developed, which have important implications for LTCC technology application. ?

Key words: LTCCsubstract, screenprinting, screengap, printingspeed