关键词: EK5600GYG, 环保塑封料, 高可靠性, 军工类产品封装

Abstract: Epoxy molding compound is the basic materials in microelectronics industrial and technological development, as one of the three main materials in the IC products molding process, with the development of packaging products to miniaturization and thinness, the performance requirement of epoxy molding compound are becoming higher and higher. At the same time, more and more original ceramic packing be replaced by epoxy molding compound packing,therefore, it is necessary to develop characters that meets the requirement of military products. The green compound of EK5600GYG is the product developed on the basis of this requirement. This product has the character such as low moisture absorption, high adhesion and high reliability, at the same time, this paper also introduced the test data , reliability test results and client reliability result.

Key words: EK5600GYG, green compound, high reliability, military products