中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (11): 110302 . doi: 10.16257/j.cnki.1681-1070.2020.1107

• 电路设计 • 上一篇    下一篇

一种集成于系统芯片的低功耗温度传感器设计

张艳飞,曹正州   

  1. 中微亿芯有限公司,江苏 无锡 214072
  • 收稿日期:2020-06-06 发布日期:2020-07-06
  • 作者简介:张艳飞(1981—),女,黑龙江佳木斯人,2004年毕业于长春理工大学,高级工程师,现任无锡中微亿芯有限公司副总经理,主要从事可编程器件及相关电路的设计技术研究。

Design of a Low Power Temperature SensorIntegrated in System Chip

ZHANG Yanfei, CAO Zhengzhou   

  1. EastTechnologies Inc., Wuxi 214072, China
  • Received:2020-06-06 Published:2020-07-06

摘要: 为了满足电子产品温度可监控、便携化和低功耗的需求,设计了一种带校准功能的低功耗温度传感器,集成于系统芯片,其核心是10位采样频率为200 kHz的Cyclic ADC。在设计中使用ping-pong操作的积分放大器来对温度电压信号进行采样和使用触发采样模式,有效降低了功耗;同时使用数字校准技术消除了工艺和设计带来的误差,提高了精度。基于UMC 55 nm 1P10M工艺完成了设计,仿真结果表明,该传感器在-55~125 ℃温度范围内,最大偏差为2.2 ℃,典型功耗为0.31 mW,满足了设计的要求。

关键词: 低功耗, 数字校准, 温度传感器

Abstract: In order to meet the requirements of temperature monitoring, portability and low power consumption of electronic products, a low power temperature sensor with calibration function is designed in this paper. It is integrated into the system chip and its core is a 10-bits Cyclic ADC with 200 kHz sample frequency. In the design, an integral amplifier with ping-pong operation is used to sample temperature voltage signals and trigger sampling mode is used to greatly reduce the power consumption. At the same time, the digital calibration technology eliminates the error caused by design and process and improves the precision. The circuit is designed based on UMC 55 nm 1P10M process. The simulation results show that the maximum deviation is 2.2 ℃, and the typical power consumption is 0.31 mW within the temperature range of -55-125 ℃, which meet the design requirements.

Key words: low power, digital calibrate, temperature sensor

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