关键词: 微铜柱凸点, 热压键合, 键合参数, 拉剪力测试

Abstract: With the increasing demand of more I/O in most products, micro copper pillar solder bump has become the mainstream of flip chip field, and thermal compression bonding is one of the most widely used bonding methods. This paper focuses on a Cu-Sn-Cu flip chip, and aims at the quality of chip bonding, the samples with different parameters were completed by using CB-600 of Athlete in Japan. The bonding quality of the samples was compared by optical microscope and tensile shear tester, and the influence of bonding parameters on bonding quality was obtained.

Key words: microcopperpillarsolderbump, thermalcompressionbonding, bondingparameters, tensilesheartest