底部填充固化程序对固化后产品微气孔的影响

doi:10.16257/j.cnki.1681-1070.2021.0903

电子与封装 ›› 2021, Vol. 21 ›› Issue (9): 090202 . doi: 10.16257/j.cnki.1681-1070.2021.0903

底部填充固化程序对固化后产品微气孔的影响

陈志健;王剑峰;朱思雄

中国电子科技集团公司第五十八研究所，江苏无锡，214072

收稿日期:2021-02-01 发布日期:2021-03-20
作者简介:陈志健（1992—），男，江苏江阴人，硕士，工程师，现从事高可靠微电子封装技术研发。

The Effect of UnderfillCuring Profile on Micro-Void Elimination of Flip Chip Products

CHEN Zhijian, WANG Jianfeng, ZHU Sixiong

China ElectronicsTechnology Group Corporation No.58 Research Institute, Wuxi214072, China

Received:2021-02-01 Published:2021-03-20

摘要/Abstract

摘要： 随着倒装封装中焊球间隙的不断缩小，底部填充工艺难度逐渐增加。该研究针对窄节距（≤90 μm）倒装产品底部填充微孔洞进行了相关研究，通过更换底部填充胶水、优化固化曲线，最终采用三段式固化程序，成功解决了微孔洞残留问题。超声波扫描以及扫描电镜分析表明微气孔在胶水反应低温段大量产生，三段式固化程序通过延长低温段反应时间，控制高分子化合物聚合反应速率（90 ℃/60 min+110 ℃/60 min+150 ℃/120 min/8 kgf），对于消除固化过程中的微气孔残留起到了重要作用。

关键词: 倒装, 底部填充, 固化程序, 微气孔, 改善

Abstract: Nowadays, with the decrease of bump pitch in advanced Flip Chip technology, the difficulties of manufacturing high-reliability FC products was increased, especially evident in underfill process. This paper presents the optimization of multi-step curing profile, which was combined with selecting appropriate UF materials in order to reducing voids formation for Fine Bump pitch-Flip Chip Chip Scale Package (FCCSP). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was adopted to scan the voids after curing process. SEM analysis was conducted to confirm whether voids formation was at the low-temperature stage. These experiments showed that extend the low-temperature curing time was benefit for minimizing or eliminating the voids formation. It was shown that the three steps curing profile play an important role?in removing voids during underfill cure process.

Key words: flipchip, capillaryunderfill, cureprofile, micro-void, improvement

中图分类号:

TN305.94

陈志健;王剑峰;朱思雄. 底部填充固化程序对固化后产品微气孔的影响[J]. 电子与封装, 2021, 21(9): 090202 .

CHEN Zhijian, WANG Jianfeng, ZHU Sixiong. The Effect of UnderfillCuring Profile on Micro-Void Elimination of Flip Chip Products[J]. Electronics & Packaging, 2021, 21(9): 090202 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

底部填充固化程序对固化后产品微气孔的影响

The Effect of UnderfillCuring Profile on Micro-Void Elimination of Flip Chip Products

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