中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (8): 080203 . doi: 10.16257/j.cnki.1681-1070.2022.0802

• 封装、组装与测试 • 上一篇    下一篇

功率级电流路径对电源管理芯片评估的影响

顾小明;李欢;徐晴昊   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214072
  • 收稿日期:2021-01-26 出版日期:2022-08-26 发布日期:2022-04-07
  • 作者简介:顾小明(1982—),男,江苏盐城人,硕士,工程师,主要研究方向为模拟电路测试应用及嵌入式系统设计。

Influence of Power Level Current Path on Power Management Chip Evaluation

GU Xiaoming, LI Huan, XU Qinghao   

  1. China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214072, China
  • Received:2021-01-26 Online:2022-08-26 Published:2022-04-07

摘要: 在测试和应用电源管理芯片时经常会遇到在重载大电流情况下电源管理芯片不能完全正常或者保持高性能地工作,导致需要花费大量的时间和精力调试修改电源供给系统的设计。从两类常见的DC-DC电源功率级拓扑结构开始阐述,重点关注功率级的电流路径对电源管理芯片测试和应用的影响,并给出几点实际应用的建议。

关键词: 电源管理芯片, 导线阻抗, 参考电位点

Abstract: When testing and applying the power management chip, it is often encountered that the power management chip cannot work properly or maintain high performance under heavy current, which leads to the need to spend a lot of time and energy to debug and modify the design of the power supply system. This paper starts with two common types of power level topologies of DC-DC power supply, focuses on the influence of power level current path on the testing and application of power management chip, and gives some practical suggestions.

Key words: power management chip, lead impedance, reference point

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