中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (2): 020401 . doi: 10.16257/j.cnki.1681-1070.2023.0003

• 材料、器件与工艺 • 上一篇    下一篇

基于过程控制和参数分布能力的元器件质量评价方法

李剑焘;孙明;张海明;宁永成;蒋承志   

  1. 中国航天宇航元器件工程中心,北京 100094
  • 收稿日期:2022-07-05 发布日期:2022-08-30
  • 作者简介:李剑焘(1986—),男,北京人,博士,工程师,从事宇航元器件质量保证工作。

Quality Evaluation forElectronicComponents Based onProcess ControlandParameter Distribution Capability

LI Jiantao, SUN Ming, ZHANG Haiming,NING Yongcheng, JIANG Chengzhi   

  1. China Aerospace Components Engineering Center,Beijing100094, China
  • Received:2022-07-05 Published:2022-08-30

摘要: 高可靠元器件制造关键工序控制能力和产品性能参数一致性水平与产品质量密切相关。对元器件产品质量表征要素和定量表征方法进行了系统研究,提出了一种基于元器件过程控制能力和关键参数分布能力的产品质量水平定量评价方法。典型品种验证结果表明,该方法可有效定量表征产品生产批质量水平。

关键词: 电子元器件, 质量评价, 过程控制, 参数分布能力

Abstract: The control capability of key processes and consistency level of product performance parameters are closely related to product quality in high reliable component manufacturing. The quality representation elements and quantitative representation methods of components are systematically studied, and a quantitative evaluation method of product quality level based on process control capability and key parameter distribution capability of components is proposed. Through the validation of typical varieties, this method can effectively quantitatively characterize the production batch quality level of products.

Key words: electronic components, quality evaluation, process control, parameter distribution capability

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