关键词: 铜线, 超声键合, 楔形键合, 正交试验

Abstract: Copper wire as the most promising new generation bonding material has excellent electrical and thermal conductivity compared with aluminum wire. Because insulated gate bipolar transistors (IGBTs)need to carry large current, copper wire can be used to improve the current transmission and heat dissipation while maintaining the same number of bonding wires. The bonding process parameters of the first and second bonding points of ceramic copper clad substrate are studied by using copper wire ultrasonic wedge bonding. The shear force is used as the method to measure the bonding quality, and the single factor analysis method is used to study the influence of each parameter on the bonding strength. The optimum process parameters are determined by orthogonal test. It provides a reference and guidance method for parameter setting of copper wire bonding process.

Key words: copper wire, ultrasonic bonding, wedge bonding, orthogonal test