纳米银焊膏贴装片式电阻的可靠性研究*

doi:10.16257/j.cnki.1681-1070.2023.0104

电子与封装 ›› 2023, Vol. 23 ›› Issue (8): 080204 . doi: 10.16257/j.cnki.1681-1070.2023.0104

纳米银焊膏贴装片式电阻的可靠性研究^*

王刘珏;顾林;郑利华;李居强

中国电子科技集团公司第五十八研究所，江苏无锡 214035

收稿日期:2022-09-08 出版日期:2023-08-24 发布日期:2023-08-24
作者简介:王刘珏（1992—），男，安徽安庆人，博士，工程师，主要研究方向为电子封装技术及可靠性分析。

ReliabilityStudy of Chip ResistorMounted With Nano-Silver Solder Paste

WANG Liujue, GU Lin, ZHENG Lihua, LI Juqiang

China ElectronicsTechnology Group Corporation No.58Research Institute, Wuxi 214035, China

Received:2022-09-08 Online:2023-08-24 Published:2023-08-24

摘要/Abstract

摘要： 采用纳米银焊膏对片式电阻进行表面贴装，并且通过加速老化试验模拟片式电阻焊点的服役环境，研究了不同的环境可靠性条件下焊点界面显微组织演变以及力学性能的变化。结果表明，纳米银焊膏采用无压烧结工艺能够实现片式电阻的表面贴装。经过环境可靠性验证后，虽然片式电阻焊点横截面的显微组织出现粗化现象，剪切断口的塑性变形区域逐渐缩小，但是其力学性能仍然满足GJB 548B-2005《微电子器件试验方法和程序》的规定。

关键词: 纳米银焊膏, 片式电阻, 环境可靠性, 显微组织, 力学性能

Abstract: Nano-silver solder paste is used to mount the chip resistors, and the service environment of chip resistance solder joints is simulated by accelerated aging test. The microstructure evolution and mechanical properties of the chip resistor joints under different environmental reliability conditions are studied.The results show that the nano-silver solder paste can achieve surface mounting of chip resistors using a pressureless sintering process. After environmental reliability verification, although the cross-sectional microstructure of the chip resistor jointsappear coarsening and the area of plastic deformation in the shear fracture is gradually reduced, but the mechanical properties of the chip resistor joints still meet the requirements of GJB 548B-2005 TestMethods and Procedures for Microelectronic Devices.

Key words: nano-silver solder paste, chip resistor, environmental reliability, microstructure, mechanical properties

中图分类号:

TG425

王刘珏, 顾林, 郑利华, 李居强. 纳米银焊膏贴装片式电阻的可靠性研究^*[J]. 电子与封装, 2023, 23(8): 080204 .

WANG Liujue, GU Lin, ZHENG Lihua, LI Juqiang. ReliabilityStudy of Chip ResistorMounted With Nano-Silver Solder Paste[J]. Electronics & Packaging, 2023, 23(8): 080204 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

纳米银焊膏贴装片式电阻的可靠性研究^*

ReliabilityStudy of Chip ResistorMounted With Nano-Silver Solder Paste

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