关键词: 有机基板, 增层膜, 成膜性, 填料, 半固化

Abstract: Build-up film is a key material for organic substrate used in integrated circuit package, which plays the role of insulation, thermal conductivity and electronic connection. The performance of the build-up film is determined by the resin system, curing system, filler, semi-curing treatment of the film and other factors. From the current research status of build-up film at home and abroad, as well as the development trend of organic substrate used in integrated circuit package, the factors affecting the consistency of the film performance are studied, and the development direction of low shrinkage, high peel strength, low dielectricity, and thermal stability of build-up film is discussed. Controlling the properties such as epoxy equivalent, molecular weight, and molecular weight distribution of electronic grade epoxy resin can achieve film processability and performance consistency. Epoxy based build-up films are the mainstream products of high-density package organic substrates. With the requirement of low dielectric constant and loss, the modification of nonpolar and symmetric functional groups of epoxy resin has become increasingly urgent.

Key words: organic substrate, build-up film, film-forming, filler, semi-curing