关键词: FCBGA有机基板, 再流焊, 翘曲, 脱湿

Abstract: Organic substrates are important carriers for IC packaging, the characteristics of their fabrication materials s have an important impact on the stability and reliability of the packaging process. In response to the warpage problem of flip chip ball grid array (FCBGA) organic substrates during the reflow soldering process, a thermal deformation tester is used to study the coplanarity and deformation of organic substrates with different sizes and different core plate thicknesses during the reflow soldering process, and the warpage behavior of FCBGA organic substrates is studied. In response to the warpage problem of large-size FCBGA organic substrates during the reflow soldering process, improvement measures are proposed in terms of dehumidification, clamping carrier and optimization of reflow soldering curves, which provide a reference for the packaging application of FCBGA organic substrates.

Key words: FCBGA organic substrate, reflow soldering, warpage, dehumidification