关键词: 铜丝SSB键合, 无空气球, 氧化, 焊盘损伤, 铝挤出

Abstract: Various technical difficulties of SSB (Stand-off Stitch Bond) interconnection for copper wire bonded in leadframe packages are analyzed, and the solution is studied and verified. The key effects of chip surface quality, bonding fixture and bonding capillary on the SSB process of copper wire are analyzed in terms of chip, manufacturing tool, material, and process. The stability of the free air ball (FAB) size under different protective gases and the stability of the FAB shape in different protective devices, as well as the techniques to prevent damage to the bonding pads of copper wire SSB and to control “Al splash” are studied, and the main points of the SSB process control and improvement methods are determined,andthe effectiveness of the described measures and methods is verified through tests.

Key words: copper wire SSB bonding, free air ball, oxidation, bonding pad damage, Al splash