中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (9): 090402 . doi: 10.16257/j.cnki.1681-1070.2023.0119

• 材料、器件与工艺 • 上一篇    

2~6 GHz小型化、高效率GaN功率放大器

刘健1,张长城2,3,崔朝探2,3,李天赐2,3,杜鹏搏1,2,3,曲韩宾1,2,3   

  1. 1.中国电子科技集团公司第十三研究所,石家庄? 050051;2.河北新华北集成电路有限公司,石家庄?050200;3.河北省卫星通信射频技术创新中心,石家庄? 050200
  • 收稿日期:2023-02-16 发布日期:2023-09-25
  • 作者简介:刘健(1974—),男,河南内黄人,硕士,高级工程师,现从事半导体的研究和管理工作。

2-6 GHz Small-Size and High-Efficiency GaN Power Amplifier

LIU Jian1, ZHANG Changcheng2,3, CUI Zhaotan2,3, LI Tianci2,3, DU Pengbo1,2,3, QU Hanbin1,2,3   

  1. 1. China Electronics Technology Group Corporation No.13Research Institute, Shijiazhuang, 050051, China; 2.North-China Integrated Circuit Co., Ltd., Shijiazhuang, 050200, China; 3.Hebei Satellite Communication RF Technology Innovation Center, Shijiazhuang, 050200, China
  • Received:2023-02-16 Published:2023-09-25

摘要: 基于GaN功率放大器小型化、轻薄化的发展趋势,选用陶瓷方形扁平无引脚(CQFN)管壳封装,设计了一种2~6 GHz宽频带、小尺寸、高效率的功率放大器,并阐述了设计方法和研制过程。随着器件功率密度的不断升高,散热问题成为设计中不可忽略的因素,分别采用热仿真分析及红外热成像测试方法,得到功率放大器芯片的最高温度为198.61 ℃,能满足散热需求。功率放大器尺寸为7.0 mm×7.0 mm×1.2 mm,在连续波测试条件下,漏极电压为28 V,工作频带为2~6 GHz,饱和输出功率大于40.5 dBm,功率增益大于23 dB,功率附加效率大于35%,测试结果均满足实际需求。

关键词: GaN功率放大器, 陶瓷方形扁平无引脚管壳封装, 小型化, 高效率, 热仿真分析

Abstract: Based on the development trend of miniaturization and thinness of GaN power amplifiers, a 2-6 GHz wide-band, small-size, and high-efficiency power amplifier is designed by choosing ceramic quad flat no-lead (CQFN) package, and the design method and development process are described.With the increasing power density of the component, the heat dissipation problem has become a factor that cannot be ignored in the design.Thermal simulation analysis and infrared thermal imaging test methods are used respectively to obtain the maximum temperature of the power amplifier chip is 198.61 ℃, which can meet the heat dissipation requirements.The size of the power amplifier is only 7.0 mm×7.0 mm×1.2 mm.Under the condition of continuous wave test, the drain voltage is 28 V, the frequency band is 2-6 GHz, the saturated output power is more than 40.5 dBm, the power gain is more than 23 dB, and the power additional efficiency is more than 35%. The test results all meet the actual requirements.

Key words: GaN power amplifier, CQFN package, miniature, high-efficiency, thermal simulation analysis

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