关键词: 共晶焊接, 真空, 气体压强, 空洞

Abstract: Vacuum eutectic soldering is an important technology and process to realize the interconnection between die and carrier. For the chip that needs eutectic, the void ratio of eutectic soldering between the chip and the carrier will directly affect the heat dissipation and output power when the chip is working. In the process of vacuum eutectic soldering, without tooling pressure, the relationship between atmosphere pressure and void rate is analyzed by using vacuum eutectic furnace. It is found that in the vacuum soldering process, pressure is applied after solder melting and forming voids, and pressure is released after solder solidification, which can significantly reduce the void rate.

Key words: eutectic soldering, vacuum, gas pressure, void