关键词: 平行缝焊, PIND, 接触电阻, 微波组件

Abstract: The residue in the package cavity of the microwave module based on bare chips seriously affects the reliability of the product, and reducing the residue in the assembly process, especially the conductive residue, plays an important role in improving the pass rate and reliability of the product PIND screening. Through the failure analysis of comprehensive stress screening of a metal-ceramic package microwave module，the formation of the nickel and golden ball in parallel seam welding process was found as the reason of the failure, which leaded to the burn of bare chip device. Improvements were made by optimizing the process parameters of parallel seam welding and increasing the angle of electrodes, which effectively reduced the nickel and gold residue during the process of parallel seam welding, and increased the pass rate of PIND screening of this component to 98%.

Key words: parallel seam welding, PIND, contact resistance, microwave module