中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (9): 090202 . doi: 10.16257/j.cnki.1681-1070.2020.0903

• 封装、组装与测试 • 上一篇    下一篇

封装结构对内置天线性能的影响

赵双领1;沈鑫1;张诚1;闫传荣1;毛臻1;曹春雨2;杨兵1   

  1. 1.中国电子科技集团公司第五十八研究所,江苏 无锡 ?214072; 2. 贵州航天电子科技集团有限公司,贵州 550009
  • 收稿日期:2020-03-26 发布日期:2020-04-20
  • 作者简介:赵双领(1989—),男,江苏徐州人,硕士学历,现从事天线、射频收发机及芯片级电源完整性、信号完整性的设计工作。

The Effect of the Package Structure on the Inside Antenna

ZHAO Shuangling1, SHEN Xin1, ZHANG Cheng1, YAN Chuanrong1, MAO Zhen1, CAO Chunyu2, YANG Bin1   

  1. 1.ChinaElectronics Technology Group Corporation No.58 Research Institute, Wuxi 214072, China;2. Guizhou Aerospace Electronic Technology Group Co., Ltd. Guizhou 550009, China
  • Received:2020-03-26 Published:2020-04-20

摘要: 天线集成封装日益复杂,针对内置定向平板天线结构,研究分析了天线辐射方向上封装盖板厚度、盖板与辐射体间距离对天线性能的影响。设计了一个工作在5.2 GHz的天线案例,通过仿真与实物测试有无平面封装陶瓷盖板的天线,验证了封装盖板厚度以及辐射体与盖板间距离在一定范围内会影响天线的工作频率,造成天线工作频带偏移等。

关键词: 封装, 内置天线, 定向平板天线

Abstract: With the increasing complexity of antenna package, this paper analyzes the effect of the board thickness and the distance between the radiator and the cover on the inside planar directional antenna. An antenna case operated at 5.2 GHz is designed. By simulating and measuring the antenna with/without planar cover ceramic board, it verifies the distance between the radiator and the cover boad within a certain range and the thickness of the cover board would affect the operation frequency of the antenna, resulting in the band offset of the antenna.

Key words: package, insideantenna, directional patch antenna

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