关键词: 封装基板, 翘曲断裂, 有限元分析法, 设计优化

Abstract: Package substrates as the carrier of the integrated circuitscan realize the electrical connection, support protection and heat dissipation of chips. Therefore, the reliability of package substrates is very crucial.In the processing of package substrates, thermal and mechanical factors such as uneven distribution of copper content and mismatch in the coefficient of thermal expansion (CTE) of the material may lead to warping and cracking of the substrate, which in turn may lead to short circuits and broken circuits, thus affecting the function of the components.Finite element analysis is used to simulate the thermal and mechanical conditions experienced by the coreless package substrate during processing, and the influence of substrate design on substrate warping and stress distribution is analyzed.Through optimization and improvement of the substrate design, simulation verification and sample processing verification, the fracture phenomenon during the processing of coreless substrates has been significantly improved.

Key words: package substrates, warpage fracture, finite element analysis method, design optimization