中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (12): 120401 . doi: 10.16257/j.cnki.1681-1070.2023.0174

• 材料、器件与工艺 • 上一篇    下一篇

等占空比周期对版图形的研究*

万鹏程1;黄彦国1;王永功1;赵海红1;张建巾1;马依依2   

  1. 1.天水天光半导体有限责任公司,甘肃 天水? 741000;2.兰州理工大学理学院,兰州? 730050
  • 收稿日期:2023-09-06 出版日期:2023-12-20 发布日期:2023-12-20
  • 作者简介:万鹏程(1991—),男,甘肃天水人,本科,工程师,主要研究方向为集成电路版图设计、集成电路制造。

Study of Period-to-Plate Pattern with Equal Duty Cycle

WAN Pengcheng1, HUANG Yanguo1, WANG Yonggong1, ZHAO Haihong1, ZHANG Jianjin, MA Yiyi2   

  1. 1. Tianshui Tianguang Semiconductor Co., Ltd., Tianshui 741000, China; 2. School of Science, Lanzhou Universityof Technology, Lanzhou 730050, China
  • Received:2023-09-06 Online:2023-12-20 Published:2023-12-20

摘要: 当图形尺寸远大于衍射极限时,由电磁波的波粒二象性可认为电磁波是沿直线传播的。忽略衍射的效应,统计学要求多次测量以满足可靠度的要求。基于中心极限定理,满足概率要求,设计了梳状对版检查结构。通过试验得出,当齿数增大时,光刻机的成像亮度会增大,也有益于提高空间像的对比度。对比不同占空比周期梳状结构的光强分布,发现占空比为50%的对版图形有益于提高空间像的对比度,且实际光刻操作过程中,不会对掩模的对准操作产生影响,能够满足工艺要求。

关键词: 衍射极限, 可靠度, 对比度, 对版图形, 占空比

Abstract: Abstracts: When the graph size of the pattern is much larger than the diffraction limit, the electromagnetic wave can be considered to propagate along a straight line by the wave-particle duality of electromagnetic waves. Neglecting the effect of diffraction, the statistic requires multiple measurements to satisfy the reliability requirement. Based on the central limit theorem and satisfying the probabilistic requirements, a comb pair checking structure is designed. Through the experiments, it is found that the imaging brightness of the lithography machine will be increased as the number of teeth increases, which is also beneficial to improve the contrast of spatial images. Comparing the light intensity distribution of comb structures with different duty cycles, it is found that the alignment pattern with a duty cycle of 50% is beneficial to improve the contrast of the spatial image and does not affect the alignment operation of the mask during the actual lithography operation, which can meet the process requirements.

Key words: diffraction limit, reliability, contrast, alignment pattern, duty cycle

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