关键词: 热阻矩阵, 热耦合, 芯片堆叠, 芯片结温

Abstract: Most of the research models for the multi-chip thermal resistance matrix are based on the multi-chip component model, that is, the multi-chip is a 2D package type, and the thermal resistance matrix of the 3D chip stack model is less researched. This paper takes the 3D chip stacking model as an example to study and analyze the thermal resistance matrix of the thermal resistance diffusion and thermal coupling of the packaged device. By changing the power of the chip inside the packaged device, simulation is used to calculate the chip junction temperature of the 3D package stack structure. Finally, the theoretical results of the thermal resistance matrix calculation and the chip junction temperature obtained by the simulation are compared and analyzed to verify the accuracy of the coupled thermal resistance matrix of the multilayer chip stack package.

Key words: thermalresistancematrix, thermalcoupling, chipstacking, chipjunctiontemperature