关键词: 系统级封装, 热阻矩阵, 有限元, 结温预测

Abstract: The semiconductor industry is developing rapidly towards high integration and small size. System-in-package (SiP), which has advantages of large-scale, multi-chip, and 3D package, has attracted more and more attention. There are many and concentrated IC chips in SiP, and the power consumption density is high, so the research of its heat dissipation characteristics is particularly important. The heat dissipation characteristics of the packaged module are characterized by thermal resistance. This article takes the plastic SiP module as the research object, introduces the device-level junction-to-case thermal resistance and board-level junction-to-board thermal resistance analysis methods, and uses the thermal resistance matrix to describe the mutual heat between the chips. Combining the application requirements of the chip, the thermal resistance matrix is used to predict the junction temperature of the internal chip of the package. The results show that the thermal resistance matrix can quickly and accurately predict the junction temperature of the chip. The junction temperature estimation method proposed in this paper is complete, feasible, convenient and efficient, and has certain application value.

Key words: system-levelpackage, thermalresistancematrix, finiteelement, junctiontemperatureprediction