关键词: 临时键合, 解键合, 晶圆级封装

Abstract: With the gradual improvement of new infrastructures such as 5G, artificial intelligence and the internet of things, it is no longer possible to rely solely on process size reduction to improve the functionality and performance of chips to meet the future needs of the integrated circuit (IC) industry. In order to meet the performance versatility and product diversification of IC, it is increasingly important to overcome the limitations of the physical scaling of Moore's Law through wafer level packaging technology. Temporary bonding/debonding (TBDB) processes have emerged as wafer-level packaging is moving towards to the direction of larger sizes, three-dimensional stacks and thinning. Aiming at the commercially available TBDB technology in wafer level packaging, the current research progress and application status of different TBDB processes in wafer level are discussed, the challenges and opportunities faced by different TBDB technologies are clarified, corresponding solutions are proposed, and future research direction is envisaged.

Key words: temporary bonding, debonding, wafer level packaging