临时键合技术在晶圆级封装领域的研究进展*
王方成, 刘强, 李金辉, 叶振文, 黄明起, 张国平, 孙蓉
Research Progress of Temporary Bonding Technology in Wafer Level Packaging
WANG Fangcheng, LIU Qiang, LI Jinhui, YE Zhenwen, HUANG Mingqi, ZHANG Guoping, SUN Rong
电子与封装
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2023, (3): 30104
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DOI: 10.16257/j.cnki.1681-1070.2023.0063
