中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (7): 070403 . doi: 10.16257/j.cnki.1681-1070.2020.0709

• 微电子制造与可靠性 • 上一篇    下一篇

一种新型的剖面化学染色技术研究

曹婷,姚雪霞   

  1. 深圳方正微电子有限公司,广东 深圳 518116
  • 接受日期:2020-03-02 发布日期:2020-04-02
  • 作者简介:曹 婷(1986—),女,吉林图们市人,本科学历,深圳方正微电子有限公司可靠性与失效分析科长,研究方向为半导体失效分析,目前以第一发明人已申请国家专利6项。

Research on a New Cross-section Chemical Staining Technology

CAO Ting, YAO Xuexia   

  1. Founder Microelectronics International Co., Ltd., Shenzhen 518116, China
  • Accepted:2020-03-02 Published:2020-04-02

摘要: 化学染色法是一种常见的PN结形貌分析方法。目前常规的化学染色技术有磨角法、滚槽法、电解水氧化法和剖面染色法。提出了一种新型的剖面化学染色技术,在传统的剖面染色法基础上新增了表面剥层、染色及观察步骤,可突破常规化学染色技术的局限,实现对PN结分布的观测及PN结缺陷的定位分析。进一步研究发现在新型剖面染色法的染色步骤使用超结染色液,可显著提升化学染色的效果和成功率。应用该化学染色技术,大大降低了半导体产品反向工程及失效分析的时间和成本,为PN结分析提供了方向。

关键词: 化学染色, 常规染色法, 剖面染色法, 超结染色液, PN结缺陷定位

Abstract: Chemical staining is a common PN junction method. At present, conventional chemical staining techniques include grinding angle method, rolling tank method, electrolytic water oxidation method and cross-section staining method. In this paper, a new cross-section chemical staining technology is proposed, which adds the steps of surface stripping, staining and observation to the traditional cross-section staining method. It can break through the limitations of conventional chemical staining technologies. It can also realize the observation of PN junction distribution and the defect location analysis of PN junction. Furthermore, it is found that the use of super junction staining solution in the new chemical staining step can significantly improve the effect and success rate of chemical staining.The time and cost for reverse engineering and failure analysis of semiconductor products are greatly reduced. And it provides a direction for PN junction analysis.

Key words: chemical staining, conventional staining methods, new staining methods, super junction staining solution, PN junction defect location

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