薄型塑封芯片钝化层损伤的失效分析与改进

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张波;李恭谨;秦培

Failure Analysis and Improvement of Passivation Layer Damage of Thin Plastic Packaging Chip

ZHANG Bo, LI Gongjin, QIN Pei

电子与封装 . 2022, (12): 120202 - . DOI: 10.16257/j.cnki.1681-1070.2022.1202