关键词: 叠层芯片, 悬空键合, 低弧键合, 3D封装

Abstract: With the development of the integrated circuit packaging technology towards the direction of high density packaging, and based on the requirement of more functional system products, which have been promoting the development of multi-stack package. In this paper, the traditional typical stacked chip packages are introduced. A cross type which is a new type of stacked chip package is described in detail. The cross type application in the ceramic packaging technology is discussed, and the reliability test of wire bonding is also researched. According to the study conclusion, the technology of wire bonding of multi-stack die also can be widely used in the ceramic packaging products.

Key words: multi-stack die, 3D package, low profile wire bonding, wire bonding on overhang