关键词: 数字信号处理, 微系统, SoC, 3D-SiP, 小型化

Abstract: On the increasing demand of circuit scale and localization, the requirement of DSP Microsystems is becoming instant. DSP Microsystems not only need reduction in physical space, but also promotion of function and easily applications. DSP Microsystems can be carried out by SOC IC, high-reliable ceramic/plastic 3D-SIP package. However, limited by the high cost and long period, the development of DSP Microsystems is seriously affected. In this paper, by carrying out a design as example, a method of repackaging finished IC in introduced, which solved the problems of high cost and long period , and achieved the goal of miniaturization at the same time.

Key words: DSP, microsystems, SoC, 3D-SiP, miniaturization