聚四氟乙烯覆铜板发展概况

doi:10.16257/j.cnki.1681-1070.2018.0059

摘要/Abstract

摘要： 聚四氟乙烯(PTFE)覆铜板以其优异的介电性能和化学稳定性而被广泛应用于高频微波电路，成为通信领域不可缺少的材料之一。根据国内外市场上的PTFE覆铜板产品，将PTFE覆铜板归纳为玻纤增强型和陶瓷粉填充型两大类，介绍了国外典型产品，并简述了国内PTFE覆铜板的研发情况。近年来国内逐步重视PTFE覆铜板的研发，但其研发产品在种类和可靠性等方面与国外还存在很大的差距，要突破国外垄断，仍面临着巨大的挑战。最后，根据通信市场的需求，总结了PTFE覆铜板的发展趋势，主要有多层化、高可靠性、多功能、低成本等。

关键词: PTFE, 覆铜板, 微波, 发展趋势

Abstract: Polytetrafluoroethylene(PTFE) copper clad laminates (CCL) are widely used in high-frequency microwave circuits for their excellent dielectric properties and chemical stability, and have become one of the indispensable materials in the field of communications. In the paper, PTFE CCL products are classified into glass fiber-reinforced and ceramic-filled types, and introduced in combination with typical foreign products. Then, the development of domestic PTFE CCLis briefly described. In recent years, China has gradually attached importance to the research and development of PTFE CCL. However, there are stillbig gaps in the types and reliability of PTFE CCLproducts between China and abroad，and it still faces enormous challenges to break through foreign monopolies. Finally, according to the needs of the communications market, the development trend of PTFE CCL is summarized: multi-layered, highly reliable, multi-functional, and low-cost.

Key words: PTFE, CCL, microwave, development trend

中图分类号:

TN41

李　苗，邹嘉佳，刘建军，程明生. 聚四氟乙烯覆铜板发展概况[J]. 电子与封装, 2018, 18(6): 1 -4.

LI Miao, ZOU Jiajia, LIU Jianjun, CHENG Mingsheng. Overview of the Development of PTFE Copper Clad Laminate[J]. Electronics & Packaging, 2018, 18(6): 1 -4.

参考文献

[1] MURALI K P, RAJESH S, PRAKASH O, et al. Preparation and properties of silica filled PTFE flexible laminates for microwave circuit applications[J]. Composites Part A, 2009, 40(8):1179-1185.
[2] CHEN Y C, LIN H C, LEE Y D. The Effects of phenyltrimethoxysilanecoupling agents on the properties of PTFE/Silica composites[J]. Journal of Polymer Research, 2004, 11(1):1-7.
[3] RAJESH S, NISA V S, MURALIi K P, et al. Microwave dielectric properties of PTFE/rutile nanocomposites[J]. Journal of Alloys & Compounds, 2009, 477(1-2):677-682.
[4]宋永要, 张立欣, 庞子博,等. 不同偶联剂对PTFE/CaTiO_3复合材料性能的影响[J]. 压电与声光, 2016, 38(2):290-292.
[5] ANIJANA P S, MAILADIL T S, SUMA M N, et al. Low dielectric loss PTFE/CeO2, ceramic composites for microwave substrate applications[J]. International Journal of Applied Ceramic Technology, 2008, 5(4):325-333.
[6] 杨维生. 微波复合介质电路基板应用现状及其发展趋势[J]. 印制电路资讯, 2015(1):93-96.
[7] 江恩伟, 杨中强. PTFE在覆铜板中的应用[J]. 印制电路信息, 2013(3):14-17.
[8] Rogers. http://www.rogerscorp.cn/ [EB/OL].

[9] Taconic. http://www.4taconic.com/ [EB/OL].

[10] XI Z, GHITA O R, EVANS K E. The unusual thermal expansion behaviour of PTFE/GF composites incorporating PTFE/GF recyclate[J]. Composites Part A, 2012, 43(11):1999-2006.

[11] HONG L, CHERYL R, WASTON J. High-Performance glass fiber development for composite applications[J]. International Journal of Applied Glass Science, 2014, 5(1):65-81.

[12] STICKEL J M, NAGARAJAN M. Glass Fiber-Reinforced Composites: From Formulation to Application[J]. International Journal of Applied Glass Science, 2012, 3(2):122-136.

[13] CHEN Y C, LIN H C, LEE Y D. The effects of filler content and size on the properties of PTFE/SiO2 composites[J]. Journal of Polymer Research, 2003, 10(4):247-258.

[14] RAJESH S, MURALI K P, RAJANI K V, et al. SrTiO3-Filled PTFE composite laminates for microwave substrate applications[J]. International Journal of Applied Ceramic Technology, 2009, 6(5):553-561.

[15] JAMES N K, JACOB K S, MURALI K P, et al. Ba(Mg1/3Ta2/3)O3 filled PTFE composites for microwave substrate applications[J]. Materials Chemistry & Physics, 2010, 122(2):507-511.

[16] YUAN Y, WANG J, YAO M, et al. Influence of SiO2 addition on properties of PTFE/TiO2 microwave composites[J]. Journal of Electronic Materials, 2017, 47(1):1-8.

[17] ARTHUR D J, SWEI G S. Ceramic filled fluoropolymetric composite material: US, US 5024871 A[P]. 1991.

[18] KUSZAJ M S. Circuit laminates, andmethod of manufacture thereof: US, US20110229709[P]. 2011.

[19] 胡福田. 高性能聚四氟乙烯覆铜板研究[D]. 广州：华南理工大学, 2005.

[20] 邵亚国, 梁杰, 邵爱国,等. 一种聚四氟乙烯玻璃纤维复合材料基板的生产工艺:CN105898984A[P]. 2016.
[21] 张立欣，宋永要, 庞子博,等. 一种微波复合介质基板制备方法:CN104211320A[P]. 2014.
[22] 黄达斐, 严长俊, 李晓晨,等. 陶瓷/PTFE 复合介质基板新成型工艺的研究[J]. 电子元件与材料, 2014, 33(4):17-21.
[23] 祝大同. 高频微波基板材料行业的发展新动向——EDI CNO China 2016展会纪实[J]. 覆铜板资讯, 2016(4):1-9.
[24] 杨维生, 彭延辉. 微波介质基板材料及选用[J]. 覆铜板资讯, 2015(5):13-18.
[25] 祝大同. 基板材料在车载毫米波雷达中应用及技术进展[J]. 印制电路信息, 2016, 24(7):30-36.
[26] 祝大同. 5G市场兴起对覆铜板行业发展的新驱动[J]. 印制电路资讯, 2017(4):47-52.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊