关键词: 陶瓷封装, 键合线, 机械冲击, 短接

Abstract: Ceramic package is commonly used in high reliability integrated circuits. However, the internal air-sealed structure of the ceramic package circuit is liable to cause the bonding wire to be easily shortened by the adjacent bonding wire after being subjected to external mechanical shock. In this paper, based on the combination of high-speed camera and electrical detection method, an improved type of short circuit detection method based on FPGA is proposed. Theoretically, this method is applicable to the FPGA circuit with any number of pins. The real-time determination is based on the CQFP228 FPGA circuit ports. The results show that this method can clearly determine the short-circuit bonded wire of the shocked circuit. This method can greatly reduce the detection steps and improve the accuracy of detection and evaluation, simultaneously.

Key words: ceramic package, bonding wire, mechanical shock, short circuit