中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2018, Vol. 18 ›› Issue (10): 36 -39. doi: 10.16257/j.cnki.1681-1070.2018.0114

• 微电子制造与可靠性 • 上一篇    下一篇

30 V NLDMOS结构优化及SEB能力提高

李燕妃,吴建伟,顾 祥,洪根深   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214072
  • 收稿日期:2018-04-17 出版日期:2018-10-20 发布日期:2018-10-20
  • 作者简介:李燕妃(1987—),女,福建福安人,硕士研究生,工艺集成工程师,现从事抗辐射集成电路工艺集成技术研究。

Structure Optimization for SEB Tolerant Enhancement in 30 V NLDMOS

LI Yanfei, WU Jianwei, GU Xiang, HONG Genshen   

  1. China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214072, China
  • Received:2018-04-17 Online:2018-10-20 Published:2018-10-20

摘要: 随着空间技术和核技术的快速发展,越来越多的先进半导体器件应用于军事和航天电子系统。利用TCAD模拟仿真软件,设计一种抗辐射加固30 V N型LDMOS器件结构,开展LDMOS器件的单粒子烧毁效应(SEB)研究。诱发单粒子烧毁效应源于N型MOSFET器件中的寄生NPN三极管在光电流作用下开启并维持工作。从版图设计和工艺设计角度考虑提高器件的抗单粒子烧毁能力的因素,包括LDD浓度、LDD长度、P型埋层结构、工作电压和LET能量等。通过抗辐射设计和工艺加固,获得击穿电压34.6 V、导通电阻只有10.04 mΩ?mm2的LDMOS器件,同时在工作电压30 V时,器件的抗单粒子烧毁能力达到100 MeV?cm2/mg。

关键词: TCAD, 抗辐射加固, 单粒子烧毁, P型埋层, LDMOS

Abstract: With the development of space and nuclear technology, there are more and more advanced semiconductor devices applied to the electronic system of military and space environment. A radiation-harden n-type LDMOS (NLDMOS) device is designed by the TCAD simulator, as well as the study of single event burnout (SEB) effect. SEB occurs when the parasitic BJT is put into a self-sustaining forward active operating mode as a result of high photocurrent. The layout and process methods are considered to enhance the structure hardened against SEB effect, including the concentration and length of LDD regions, p-type buried layer, operating voltage, LET energy, and so on. Based on the radiation hardened design and process, a NLDMOS device is acquired with the breakdown voltage of 34.6 V and specific on-resistance of 10.04 mΩ?mm2. As a result, the n-type LDMOS device achieves a LET threshold of 100 MeV?cm2/mg with a 30 V operating voltage.

Key words: TCAD, radiation hardened, single event burnout, P-type buried layer, LDMOS

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