中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (4): 06 -9. doi: 10.16257/j.cnki.1681-1070.2019.0037

• 封装、组装与测试 • 上一篇    下一篇

功率器件封装体填充不良分析及改进措施

李明奂   

  1. 天水华天电子集团,甘肃 天水 741000
  • 收稿日期:2018-12-11 出版日期:2019-04-20 发布日期:2020-01-16
  • 作者简介:李明奂(1968—),男,甘肃天水人,1988年毕业于无锡无线电工业学校,工程师,现从事功率器件封装与工艺研究工作。

Poor Packing Analysis and Improvement Measures of Power Device Package

LI Minghuan   

  1. Tianshui Huatian Electronics Group, Tianshui 741000, China
  • Received:2018-12-11 Online:2019-04-20 Published:2020-01-16

摘要: 填充不良是功率器件塑料封装过程中的常见问题,如何减少填充不良的产生和预防填充不良产品的出现是塑封设备工程师、功率器件产品设计师、模塑料生产商、模具制造商共同探讨的问题。描述了填充不良对组装的危害,阐述了功率器件封装过程中常见的填充不良发生机理,从塑封产品设计、模塑料、工艺方法等方面进行分析,提出了有效的改善措施,对塑料封装改进质量和模塑料、模具等的开发工作有借鉴意义。

关键词: 功率器件;注塑;填充不良;模塑料

Abstract: Defective filling is a common problem in the plastic packaging of power devices. How to reduce the generation of defective filling and prevent the occurrence of defective filling products is a common problem discussed by the engineers of plastic sealing equipment, product designers of power devices, plastic mold manufacturers and mold manufacturers. The harm of poor filling to assembly and the common mechanism of poor filling in the packaging process of power devices are described. Effective improvement measures are put forward by analyzing the design of plastic sealing products, molding plastics, process methods and other aspects, which provides some references for improving the quality of plastic packaging and developing molding plastics and molds.

Key words: power device; assembly; defective filling; EMC

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