中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2016, Vol. 16 ›› Issue (6): 43 -47.

• 产品、应用与市场 • 上一篇    

一种WLCSP元器件先进运输包装材料解决方案

杨青   

  1. 3M中国有限公司北方技术分公司,北京100176
  • 收稿日期:2016-01-26 出版日期:2016-06-20 发布日期:2016-06-20
  • 作者简介:杨青(1979-),女,河北人,硕士研究生,电子材料应用资深工程师,主要从事半导体、电子移动终端市场的电子材料研究工作,包括包装、粘接、屏蔽、导热、光学材料等.

Advanced Transport Package Material Solution for WLCSP Component

YANG Qing   

  1. 3M North China Technical Center,Beijing 100176,China
  • Received:2016-01-26 Online:2016-06-20 Published:2016-06-20

摘要: 报道了一种用于WLCSP电子元器件的先进运输包装材料,即3M先进载带盖带技术.首先介绍了WLCSP元器件的特点及其对运输包装材料的特殊需求,重点介绍了3M先进载带和盖带技术针对这些需求的解决方案.由PC材质制作成的载带,其强度高、不易变形,能更好地保护元器件.特殊的一体化成型工艺提供了高尺寸精度载带,能更好地匹配元器件尺寸.专利性的设计方案既保护了元器件不易受损也保证了贴片的高效率.同时,3M洁净载带产品满足了WLCSP元器件的高洁净度要求.同时介绍了压敏型防粘盖带,其具有更稳定的剥离力,而且采用防粘材料也大大解决了元器件和盖带粘料的问题.

关键词: WLCSP;载带;盖带

Abstract: 3M advanced carrier tape and cover tape solutions for WLCSP component transport package is presented in the paper.The paper at first briefly introduces the WLCSP component and its special requirements for transport packaging materials which could be met by 3M advanced carrier tape and cover tape solutions.The PC resin-made carrier tape exhibits good mechanical strength and resistance to deformation and better protects component.Special integrated molding guarantees precise dimension.Patented pocket design protects WLCSP component and ensures efficient SMT.Meanwhile, 3M high-purity carrier tape meets the strict requirement of WLCSP components.The paper also introduces the pressure-sensitive cover tape with anti-stick property,which has more stable peel force.

Key words: WLCSP, carrier tape, cover tape

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