中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (6): 060101 . doi: 10.16257/j.cnki.1681-1070.2020.0606

• 综述 •    下一篇

现代元器件尺寸测量方法

罗宏伟,周帅,马凌志,项舰,罗捷   

  1. 工业和信息化部电子第五研究所,广州 510610
  • 接受日期:2020-03-11 出版日期:2020-06-17 发布日期:2020-03-20
  • 作者简介:罗宏伟(1968—),男,湖南长沙人,博士,研究员,主要研究方向为电子元器件产品检测与质量可靠性研究。

Measurement of Dimension Methods for Electronic Components

LUO Hongwei, ZHOU Shuai, MA Lingzhi, XIANG Jian, LUO Jie   

  1. CEPREI, Guangzhou 510610, China
  • Accepted:2020-03-11 Online:2020-06-17 Published:2020-03-20

摘要: 尺寸测量是评估元器件的结构是否满足设计要求及安装匹配性的重要手段。介绍了现代元器件尺寸测量的主要方法及测量原理,包括接触式三坐标测量、激光三角测量及激光共聚焦测量等新技术。针对现代元器件测量难点,对不同测量方法的适用范围及局限性进行了论述,并总结了现代元器件尺寸测量仍需要解决的一些典型问题。

关键词: 尺寸测量, 电子元器件, 接触式测量, 非接触式测量

Abstract: The measurement of dimension is a crucial tool to evaluate the structure and the matching with PCB. The main methods and measuring principles of electronic components measurement are presented here, including contact three coordinate measuring system, laser triangulation measuring system and laser confocal measuring system. With the measurement difficulties of electronic components, the application and limitations of different measurement methods are discussed and some typical problems in electronic component measurement are summarized.

Key words: dimension measurement, electronic components, contact measurement, non-contact measurement

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