中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (3): 030303 . doi: 10.16257/j.cnki.1681-1070.2021.0308

• 电路设计 • 上一篇    下一篇

基于0.15μm GaN工艺的2~18 GHz两级分布式放大器

贾洁;蔡利康   

  1. 中国电子科技集团公司第五十五研究所,南京 210016
  • 收稿日期:2020-05-08 出版日期:2021-03-23 发布日期:2020-10-13
  • 作者简介:贾洁(1982—),女,江苏南京人,工学硕士,研究方向为GaAs、GaN半导体器件/电路可靠性。

ChinaElectronics Technology Group Corporation No.55Research Institute,Nanjing210016,China

JIA Jie, CAI Likang   

  1. Keywords: ultra-broadband; distributed PA; power amplifier
  • Received:2020-05-08 Online:2021-03-23 Published:2020-10-13

摘要: 介绍了一款2~18 GHz宽带放大器MMIC,该MMIC利用0.15 μm GaN HEMT工艺设计加工,采用两级分布式结构设计,实现了较高的整体电路增益。利用Agilent ADS仿真设计软件对整体电路的原理图和版图进行仿真优化设计。在2~18 GHz工作频率范围内,电路小信号增益大于20 dB,增益平坦度小于±1.5 dB,输入输出回波损耗小于-10 dB,Pmax>31 dBm,PAE>7%,电路工作电压25 V,最大功耗7 W,芯片面积为4.5 mm ×2.5 mm。

关键词: ?超宽带, 分布式, 功率管放大器

Abstract: A 2~18 GHz wide band MMIC is designed and manufactured by 0.15 μm GaN HEMT process in this paper. Two stage distribute amplifier is used to improve the gain. The overall circuit schematic and layout is simulated and optimized in momentum of ADS. The electrical characteristics are as follows, in the working frequency range of 2~18 GHz, small signal gain > 20 dB, gain flatness is ±1.5 dB, input and output return loss < -10 dB, Pmax > 31 dBm, PAE > 7%. The working voltage of the circuit is 25 V, a maximum power consumption is 7 W, and a chip area is 4.5 mm×2.5 mm.

Key words: ultra-broadband, distributedPA, poweramplifier

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