电子与封装 ›› 2025, Vol. 25 ›› Issue (9): 090601 . doi: 10.16257/j.cnki.1681-1070.2025.0170

• 封装前沿报道 • 上一篇    

基于MLP-LSTM机器学习模型的烧结纳米银高温老化力学性能快速反演与预测

赵利波，代岩伟，秦飞   

Rapid Inversion and Prediction of High-Temperature Aging Mechanical Properties of Sintered Nanosilver Based on MLP-LSTM Machine Learning Models

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