基板型模块的直压模塑和注塑模塑分析

doi:10.16257/j.cnki.1681-1070.2019.0601

电子与封装 ›› 2019, Vol. 19 ›› Issue (6): 01 -5. doi: 10.16257/j.cnki.1681-1070.2019.0601

• 封装、组装与测试 • 下一篇

基板型模块的直压模塑和注塑模塑分析

杨建伟

广东气派科技有限公司，广东东莞 523000

收稿日期:2019-03-13 出版日期:2019-06-19 发布日期:2019-06-19
作者简介:杨建伟（1981—），男，陕西安康人，本科，现任广东气派科技有限公司研发经理，从事半导体封装研发工作。

Study of Compression Mold and Transfer Moldon Substrate Module

YANG Jianwei

Guangdong Chippacking Technology Ltd.,Dongguan 523000,China

Received:2019-03-13 Online:2019-06-19 Published:2019-06-19

摘要/Abstract

摘要： 模塑是半导体封装中十分重要的工艺，不同结构特性的基板型模块对模塑工艺要求也不同。分析了基板型模块直压模塑和注塑模塑的特性及效果，包括模塑外观、翘曲、金丝冲丝以及模塑料的填充性，并对比分析不同复杂度结构的基板型模块模塑料的填充效果，发现直压模塑和注塑模塑各有优劣。直压模塑工艺的模塑料不流动特性使其在填充流动小的封装中具有明显的优势。明确了两种模塑技术的不同适用性，为不同应用中选择合适的模塑工艺方案提供指导。

关键词: 翘曲, 直压模塑封, 冲丝, 注塑模塑封, 填充性, 翘曲, 冲丝, 填充性

Abstract: Molding is very important process in semiconductor package,the different package structure requires different mold technologies.Characteristics and effects of compression mold and transfer mold,including the mold thickness,warpage,wire sweep and compound fill ability base on mold features,especially on the fill effect for some complicated structure package are studied.The advantage and shortage both in compression mold and transfer mold are found out.Compression mold has significant advantage on mold fill without compound flow.The characteristics of two mold technologies are specified,which helps to choose the proper mold solution for different applications.

Key words: compression mold, transfer mold, warpage, compression mold, wire sweep, transfer mold, fill ability, warpage, wire sweep, fill ability

中图分类号:

TN305.94

杨建伟. 基板型模块的直压模塑和注塑模塑分析[J]. 电子与封装, 2019, 19(6): 01 -5.

YANG Jianwei. Study of Compression Mold and Transfer Moldon Substrate Module[J]. Electronics & Packaging, 2019, 19(6): 01 -5.

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

基板型模块的直压模塑和注塑模塑分析

Study of Compression Mold and Transfer Moldon Substrate Module

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