中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (9): 034 -36. doi: 10.16257/j.cnki.1681-1070.2019.0909

• 微电子制造与可靠性 • 上一篇    下一篇

电动汽车用IGBT模块铜底板设计

刘艳宏,邢 毅,董 妮,荆海燕   

  1. 中车永济电机有限公司,西安中车永电电气有限公司,西安 710016
  • 收稿日期:2019-06-12 出版日期:2019-09-20 发布日期:2019-09-20
  • 作者简介:刘艳宏(1983—),女,陕西西安人,硕士,工程师,主要从事IGBT器件设计,目前研究方向为电动汽车用IGBT器件设计及可靠性研究。

Copper Baseplate Design of IGBT Module for Electric Vehicles

LIU Yanhong, XING Yi, DONG Ni, JING Haiyan   

  1. CRRC Yongji Electric Co., Ltd., Xi’an 710016, China
  • Received:2019-06-12 Online:2019-09-20 Published:2019-09-20

摘要: 对电动汽车用绝缘栅双极性晶体管(IGBT)模块铜底板进行预弯设计,使其具有一定的弧度,以抵消铜底板在焊接时的变形,保证铜底板与散热器之间的接触面平面度,进而保证散热量。通过加工9组不同预弯高度H值的铜底板进行焊接实验和安装扭矩模拟试验,并分别对铜底板预弯高度H值为550 μm、600 μm的IGBT模块进行3D轮廓测量和超声波扫描,最终设定预弯高度H值为550~600 μm。

关键词: 电动汽车, IGBT, 铜底板, 预弯弧度, 平面度

Abstract: In order to offset the deformation of the copper baseplate during soldering, to ensure the flatness of the contact surface between the copper base plate and the heat sink, and to ensure the heat dissipation, the copper baseplate of IGBT module for electric vehicle is pre-bent to make it have a certain radian. The solering experiments and installation torque simulation experiments were carried out on nine groups of copper baseplate with different pre-bending height H values. The IGBT modules with pre-bending height H of 550 and 600 microns were measured by 3D profilometry and scanned by ultrasonic wave, respectively. The pre-bending height H values are 550-600 microns.

Key words: electric vehicle, IGBT, copper baseplate, pre-bending radian, flatness

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